STRENGTHENED GLASS AND METHODS FOR MAKING USING HEAT TREATMENT

摘要

Chemically strengthened glass with reduced induced curvature and a method for making utilizing a heat treatment are provided. The method includes providing a substrate, having a width, and characterized by having a glass chemical structure including host alkali ions having an average ionic radius situated in the glass chemical structure. The substrate also includes dimensional volumes including a treatment-rich volume and a treatment-poor volume located as opposed to each other in the provided substrate. The method also includes heating the provided substrate to a heat-treating temperature for a heat-treating period to produce a heat-treated substrate. The method also includes providing an exchange medium including invading alkali ions. The method also includes applying the exchange medium and conducting ion exchange to produce the strengthened substrate with reduced induced curvature.

主权项

1. A method for making a strengthened substrate, the method comprising:
providing a substrate, having a width ≦ about 25.0 millimeters, characterized by having a glass chemical structure including host alkali ions having an average ionic radius situated in the glass chemical structure and dimensional volumes including a treatment-rich volume and a treatment-poor volume located as opposed to each other in the provided substrate; heating the provided substrate to a heat-treating temperature ≧ about 250° C. and ≦ a maximum heat-treating temperature for a heat-treating period of about 0.001-50 hours, wherein if the heat-treating temperature is ≦ about 325° C., then the heat-treating period is ≧ about 2 hours, to produce a heat-treated substrate; providing an exchange medium including invading alkali ions having an average ionic radius that is larger than the average ionic radius of the host alkali ions; exposing the heat-treated substrate to the exchange medium; and conducting ion exchange while exposing the heat-treated substrate to the exchange medium to produce the strengthened substrate,
wherein the strengthened substrate includes a compressive stress layer having a depth of about 1-500 μm.