| 摘要 |
<p>Disclosed is a chip thermal dissipation structure, employed in an electronic device comprising a first chip having a first chip face and a first chip back, which comprises: a chip molding material for covering a lateral of the first chip; a first case for contacting the first chip back; a packaging substrate for connecting with the first chip face via first bumps; and a printed circuit board which has a first surface and a second surface and connects with the packaging substrate via solders. The chip thermal dissipation structure further comprises a second case which contacts the second surface. The thermal energy generated by the first chip is conducted toward the first case via the first chip back and toward the second case via the first chip face, the first bumps, the packaging substrate, the solders, and the printed circuit board.</p> |
