| 摘要 |
The present invention provides a chip package and a method for manufacturing the same. The chip package comprises: an insulating layer in which a through hole is formed; a circuit pattern layer which is in close contact directly with one surface of the insulating layer; a heat dissipation unit disposed on the other surface of the insulating layer; an adhesive layer for adhering the circuit pattern layer and the heat dissipation unit to each other; and a chip mounted onto a part of the heat dissipation unit exposed by the through hole. According to the present invention, a thickness can be significantly reduced by using a two-layer FCCL than using a conventional three-layer FCCL. In addition, manufacturing cost of the chip package can be reduced by removing the adhesive layer for bonding a conventional insulating film and a metal layer. |
