PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

摘要

The present invention forms an insulating layer by using a prepreg of roughness performed by two hardening processes when a PCB is manufactured. Therefore, when the thermal bonding tape is firmly attached to the insulating layer, a thermal bonding tape is attached onto the prepreg due to the roughness of the prepreg. Therefore, the adhesion to the insulating layer of the PCB of the thermal boding tape is improved.