| 摘要 |
The present invention relates to a package structure and a package method. The package structure includes an IC die including a plurality of die pads formed on a surface; a flexible package substrate including a plurality of first pads formed on a first surface and a plurality of second pads formed on a second surface; a plurality of bumps previously formed on the first surface of the flexible package substrate, each having variable height, corresponding to the respective first pads, and making contact with the die pads for conducting packaging on the IC die; and a circuit board including a plurality of circuit board contact points, wherein the second pads of the flexible package substrate are joined to the circuit board by making contact with the circuit board contact points through solders. According to the present invention, since very small stress is generated in the package substrate and the circuit board, the cracks of the bumps and soldering join due to stress and the insufficient and cold soldering due to the bump and solder can be solved. |
