PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a printed circuit board and a manufacturing method thereof. A method of manufacturing a printed circuit board according to the present invention includes providing a via hole to an insulating layer, forming a mask on the insulating layer to form the width of the opening part of the mask which is narrower than the width of the upper opening part of the via hole, and forming a via by filling the via hole with a metallic material.