发明名称
摘要 An assignment method of terminals of a semiconductor package executed by an assignment supporting apparatus includes: deciding a maximum allowable distance to be a constraint condition regarding a relative distance between each of the pads and a terminal to be assigned to the pad, and extracting one or a plurality of assigned terminal candidates for each of the pads so that the relative distance between each of the pads and a terminal selected for the pad falls within a range of the maximum allowable distance; and deciding one of the terminals as a assigned terminal based on the assigned terminal candidates and assigning the one of the terminals to one of the pads. The process is a process to assign one of the terminals with priority to a pad having a smallest number of assigned terminal candidates in a not-assigned condition based on the assigned terminal candidates.
申请公布号 JP5534025(B2) 申请公布日期 2014.06.25
申请号 JP20120542696 申请日期 2010.11.10
申请人 发明人
分类号 G06F17/50;H05K3/00 主分类号 G06F17/50
代理机构 代理人
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