发明名称 |
FLIP-CHIP BONDED IMAGER DIE |
摘要 |
An image sensor includes an imager die, a circuit board, and an optical layer. The circuit board is flip-chip bonded to the imager die. The optical layer is adhered to the circuit board and includes a first portion configured to refract light differently than a second portion. Both the first portion and the second portion are integrally formed with the optical layer. |
申请公布号 |
EP2745324(A2) |
申请公布日期 |
2014.06.25 |
申请号 |
EP20120768926 |
申请日期 |
2012.08.20 |
申请人 |
IMI USA, INC. |
发明人 |
PATTERSON, TIMOTHY, PATRICK;MORAN, TIM;FORREST, CRAIG |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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