LIGHT EMITTING DEVICE

摘要

The disclosure relates to a light emitting device comprising a semiconductor light emitting chip; a housing receiving the semiconductor light emitting chip by including a cavity whose upper side is opened; a lead frame integrally formed with the housing, supporting the semiconductor light emitting chip, and applying power; and a sealing part including a filler layer which includes filler and transparent resin and is dispensed in the cavity to cover the semiconductor light emitting chip and a phosphor layer which includes a phosphor and transparent rein and is dispensed in the cavity to cover the filler layer.