| 摘要 |
PURPOSE: A substrate processing apparatus, a coating and developing apparatus including the same, and a substrate processing method are provided to prevent defects by widening a space between wires. CONSTITUTION: A carrier station has a placement table (21) and a transfer device. A carrier (20) is replaced on the placement table. Four carriers are placed on the replacement table in parallel. The transfer device extracts a wafer from the carrier. The transfer device transfers the wafer to a processing station. [Reference numerals] (AA) TCT layer; (BB) COT layer; (CC) BCT layer; (DD) DEV layer |
