发明名称 Highly dilutable polishing concentrates and slurries
摘要 <p>The present disclosure provides a chemical mechanical polishing slurry, and a method of producing such a slurry by diluting a concentrate to a point of use slurry. The slurry is obtained by diluting a concentrate comprising abrasive, complexing agent, and corrosion inhibitor, and the concentrate with water and an oxidizer. The concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.</p>
申请公布号 EP2746354(A2) 申请公布日期 2014.06.25
申请号 EP20140150131 申请日期 2010.10.15
申请人 FUJIFILM PLANAR SOLUTIONS LLC 发明人 KIM, HYUNGJUN;WEN, RICHARD;HU, BIN;TANAKA, MINAE;MAHULIKAR, DEEPAK
分类号 C09G1/02;H01L21/321;H01L21/768 主分类号 C09G1/02
代理机构 代理人
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