COPPER ALLOY SHEET FOR ELECTRICAL/ELECTRONIC COMPONENTS, AND METHOD FOR PRODUCING SAME

摘要

Disclosed is a copper alloy material for electrical/electronic components, which consists of 3.0-13.0% by mass of Sn, 0.01-2.0% by mass in total of either or both of Fe and Ni, and 0.01-1.0% by mass of P, with the balance made up of Cu and unavoidable impurities. The copper alloy material for electrical/electronic components has an average crystal grain diameter of 1.0-5.0 [mu]m and a tensile strength of not less than 600 MPa. In the copper alloy material, compounds X having an average diameter of not less than 30 nm but not more than 300 nm are distributed at a density of 104-108 pieces/mm2, and compounds Y having an average diameter of more than 0.3 [mu]m but 5.0 [mu]m or less are distributed at a density of 102-106 pieces/mm2.