| 摘要 |
A optical semiconductor apparatus includes a lid body bonded to an upper surface of a frame body, the lid body having an opening at a position vertically overlapping with an optical semiconductor device. The lid body has a first portion which is positioned so as to surround the opening and has an upper surface to which a light-transmissive member is bonded, a second portion which is positioned so as to surround the first portion, and a third portion which is positioned so as to surround the second portion and has a lower surface to which the frame body is bonded. The upper surface of the first portion is positioned lower than an upper surface of the third portion. The second portion has a thin-walled portion positioned so as to surround the first portion, the thin-walled portion having a thickness thinner than that of the first portion as well as thinner than that of the third portion. |
