Underfill material dispensing for stacked semiconductor chips

摘要

A template having tapered openings can be employed to enable injection of underfill material through gaps having a width less than a lateral dimension of an injector needle for the underfill material. Each tapered opening has a first lateral dimension on an upper side and a second lateral dimension on a lower side. Compliant material portions can be employed to accommodate variations in distance between the template and stacked semiconductor chips and/or an injector head. Optionally, another head can be employed to apply compressed gas to push out the underfill material after the underfill material is applied to the gaps. Multiple injector heads can be employed to simultaneously inject the underfill material at different sites. An adhesive layer can be substituted for the at least one lower compliant material portion.

主权项

1. A structure comprising:
a bonded structure including a plurality of semiconductor chips bonded to a substrate; and a template disposed over said bonded structure, said template including a plurality of template openings extending between a proximal surface and a distal surface of said template, wherein each of said plurality of template openings has a first lateral dimension at said proximal surface and has a second lateral dimension that is greater than said first lateral dimension at said distal surface, wherein said distal surface is more distal from said bonded structure than said proximal surface, wherein each template opening among said plurality of template openings overlies a gap between a neighboring pair of semiconductor chips among said plurality of semiconductor chips.