发明名称 |
Backside illuminated image sensor with stressed film |
摘要 |
An image sensor includes a photosensitive region disposed within a semiconductor layer and a stress adjusting layer. The photosensitive region is sensitive to light incident through a first side of the image sensor to collect an image charge. The stress adjusting layer is disposed over the first side of the semiconductor layer to establish a stress characteristic that encourages photo-generated charge carriers to migrate towards the photosensitive region. |
申请公布号 |
US8759934(B2) |
申请公布日期 |
2014.06.24 |
申请号 |
US201213649953 |
申请日期 |
2012.10.11 |
申请人 |
OmniVision Technologies, Inc. |
发明人 |
Tai Hsin-Chih;Rhodes Howard E.;Zheng Wei;Venezia Vincent;Qian Yin;Mao Duli |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
Blakely Sokoloff Taylor & Zafman LLP |
代理人 |
Blakely Sokoloff Taylor & Zafman LLP |
主权项 |
1. An image sensor, comprising:
an epitaxial layer; an array of pixels each including a photosensitive region disposed within the epitaxial layer, the photosensitive region positioned to collect an image charge in response to light incident through a first side of the epitaxial layer; and a first stress adjusting layer disposed over the first side of the epitaxial layer establishing a first stress characteristic on the epitaxial layer to encourage photo-generated charge carriers to migrate towards a second side of the epitaxial layer opposite of the first side, wherein the first stress adjusting layer is disposed on the epitaxial layer to apply a patterned stress characteristic to the epitaxial layer such that the first stress adjusting layer applies the first stress characteristic to a first portion of a given pixel on the first side of the epitaxial layer while substantially not applying the first stress characteristic to a second portion of the given pixel on the first side of the epitaxial layer.
|
地址 |
Santa Clara CA US |