System for connecting a first substrate to a second substrate

摘要

An interconnect apparatus for interconnecting electrical components includes a body and a spring element retained by and extending from the body. The apparatus is configured so that a portion thereof may be captured between first and second substrates and to connect electrical circuits lying in different planes.

主权项

1. A system comprising:
a first substrate; a first bonding pad disposed on a surface of said first substrate; a second substrate; a second bonding pad disposed on a surface of said second substrate; said second substrate attached to said surface of said first substrate; said second substrate having an edge, and defining:
a first slot extending inwardly from said edge; anda second slot extending inwardly from said edge; and a body comprising:
a core portion;a first leg extending from said core portion;a first flange extending from said first leg;a second leg extending from said core portion;a second flange extending from said second leg;a spring element having a center section, a first end section and a second end section, said center section connected to said body, and said first end section and said second end section extending from said body; at least a portion of said first leg received by said first slot and at least a portion of said first flange engaged with said second substrate; at least a portion of said second leg received by said second slot and at least a portion of said second flange engaged with said second substrate; said first end section of said spring element electrically connected to said first bonding pad and said second end section of said spring element electrically connected to said second bonding pad.