发明名称 |
SEMICONDUCTOR CHIP TEST SOCKET AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>The present invention relates to a semiconductor chip test socket and a manufacturing method thereof. According to the present invention, the semiconductor chip test socket comprises: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip.</p> |
申请公布号 |
KR101410866(B1) |
申请公布日期 |
2014.06.24 |
申请号 |
KR20130041650 |
申请日期 |
2013.04.16 |
申请人 |
SHIN, JONG CHEON |
发明人 |
SHIN, JONG CHEON;HA, DONG HO |
分类号 |
G01R31/26;H01L21/66 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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