发明名称 SEMICONDUCTOR CHIP TEST SOCKET AND MANUFACTURING METHOD THEREOF
摘要 <p>The present invention relates to a semiconductor chip test socket and a manufacturing method thereof. According to the present invention, the semiconductor chip test socket comprises: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip.</p>
申请公布号 KR101410866(B1) 申请公布日期 2014.06.24
申请号 KR20130041650 申请日期 2013.04.16
申请人 SHIN, JONG CHEON 发明人 SHIN, JONG CHEON;HA, DONG HO
分类号 G01R31/26;H01L21/66 主分类号 G01R31/26
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