Electronic device using heat dissipation assembly

摘要

An electronic device includes a central processing module having a base board, a central processing unit fixed to the base board, and a heat dissipation assembly secured to the base board. The heat dissipation assembly has a first heat sink, a second heat sink and an air deflector. The air deflector blocks an opening of the channel to deflect and guide airflow flow through the first heat sink and the second heat sink.

主权项

1. A heat dissipation assembly, comprising:
a base board including two parallel securing poles vertically protruding therefrom; a first heat sink secured above the base board by the parallel securing poles; a second heat sink secured on the base board and abutting against the first heat sink; a channel defined between the first heat sink, the second heat sink and the base board, the channel defining an opening; and an air deflector blocking the opening to deflect and guide airflow flow through the first heat sink and the second heat sink.