PACKAGE ON PACKAGE TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a package on package type semiconductor package and a manufacturing method thereof. A package on package type semiconductor package according to the present invention forms a metal post on the substrate of a lower package on which a device is mounted, forms a conductive bump which has the same width as the metal post in the upper surface of the metal post, and connects an upper package on which a device is formed to the conductive bump.