Methods for interconnecting bonding pads between components

摘要

The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process bonds multiple interconnect wires to bond pads with electrical linkages between the bond pads and then subsequently separates the adjacent bond pads.

主权项

1. A method for interconnecting bond pads between integrated components, the method comprising:
applying an electrically conductive adhesive line on multiple bond pads along a direction of the multiple bond pads of an integrated component; placing multiple interconnect wires on the electrically conductive adhesive line on corresponding bond pads of a integrated component; bonding the multiple interconnect wires to the bond pads, the bonding process providing electrical linkage between adjacent bond pads; and electrically separating the electrically conductive line between the adjacent bond pads.