| 发明名称 | Method for manufacturing integral imaging device | ||
| 摘要 | In a method for manufacturing an integral imaging device, a layer of curable adhesive is first applied on a flexible substrate and half cured such that the curable adhesive is solidified but is capable of deforming under external forces. Then the curable adhesive is printed into a lenticular lens having a predetermined shape and size using a roll-to-roll processing device and fully cured such that the curable adhesive is capable of withstanding external forces to hold the predetermined shape and size. Last, a light emitting diode display is applied on the flexible substrate opposite to the lenticular lens such that an image plane of the light emitting diode display coincides with a focal plane of the lenticular lens. | ||
| 申请公布号 | US8759164(B2) | 申请公布日期 | 2014.06.24 |
| 申请号 | US201213527910 | 申请日期 | 2012.06.20 |
| 申请人 | Hon Hai Precision Industry Co., Ltd. | 发明人 | Hsu Chia-Ling |
| 分类号 | H01L21/20 | 主分类号 | H01L21/20 |
| 代理机构 | Novak Druce Connolly Bove + Quigg LLP | 代理人 | Novak Druce Connolly Bove + Quigg LLP |
| 主权项 | 1. A method for manufacturing an integral imaging device, the method comprising: distributing a layer of curable adhesive to a flexible substrate; half curing the curable adhesive layer such that the curable adhesive layer is solidified but is capable of deforming upon external forces; printing the curable adhesive layer into a lenticular lens having a predetermined shape and size using a roll-to-roll processing device; fully curing the curable adhesive layer such that the curable adhesive layer is capable of withstanding external forces to hold the predetermined shape and size; and forming a light emitting diode display on the flexible substrate opposite to the lenticular lens such that an image plane of the light emitting diode display coincides with a focal plane of the lenticular lens. | ||
| 地址 | New Taipei TW | ||