Approach for bonding dies onto interposers

摘要

A method includes providing an interposer wafer including a substrate, and a plurality of through-substrate vias (TSVs) extending from a front surface of the substrate into the substrate. A plurality of dies is bonded onto a front surface of the interposer wafer. After the step of bonding the plurality of dies, a grinding is performed on a backside of the substrate to expose the plurality of TSVs. A plurality of metal bumps is formed on a backside of the interposer wafer and electrically coupled to the plurality of TSVs.

主权项

1. A method comprising:
bonding a plurality of dies onto a front surface of an interposer wafer, wherein the interposer wafer comprises:
a substrate; anda plurality of through-substrate vias (TSVs) extending from a front surface of the substrate into the substrate; after the step of bonding the plurality of dies, filling a molding compound into gaps between the plurality of dies; grinding the molding compound and a top surface of the plurality of dies; after the step of grinding on the molding compound, performing a grinding on a backside of the substrate to expose the plurality of TSVs; and forming a plurality of metal bumps on a backside of the interposer wafer and electrically coupled to the plurality of TSVs.