发明名称 |
Method for making light emitting diode |
摘要 |
A method for making a light emitting diode includes the following steps. A substrate having a first epitaxial growth surface is provided. A carbon nanotube layer is placed on the first epitaxial growth surface of the substrate. A surface of the first semiconductor layer is exposed by removing the substrate and the carbon nanotube layer. The surface of the first semiconductor layer is defined as a second epitaxial growth surface. An active layer and a second semiconductor layer are grown on the second epitaxial growth surface in that order. A surface of the active layer contacted the first semiconductor layer engages with the second epitaxial growth surface. A part of the first semiconductor layer is exposed by etching a part of the active layer and the second semiconductor layer. A first electrode is applied on the first semiconductor layer and a second electrode is applied on the second semiconductor layer. |
申请公布号 |
US8759130(B2) |
申请公布日期 |
2014.06.24 |
申请号 |
US201213729268 |
申请日期 |
2012.12.28 |
申请人 |
Tsinghua University;Hon Hai Precision Industry Co., Ltd. |
发明人 |
Wei Yang;Fan Shou-Shan |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
Novak Druce Connolly Bove + Quigg LLP |
代理人 |
Novak Druce Connolly Bove + Quigg LLP |
主权项 |
1. A method for making a light emitting diode, the method comprising:
providing a substrate having a first epitaxial growth surface; placing a carbon nanotube layer on the first epitaxial growth surface of the substrate; epitaxially growing a first semiconductor layer on the first epitaxial growth surface; exposing a surface of the first semiconductor layer by removing the substrate and the carbon nanotube layer, wherein the surface of the first semiconductor layer is defined as a second epitaxial growth surface; growing an active layer and a second semiconductor layer on the second epitaxial growth surface in that order, wherein a surface of the active layer contacting the first semiconductor layer engages with the second epitaxial growth surface; exposing a part of the first semiconductor layer by etching a part of the active layer and the second semiconductor layer; and applying a first electrode on the first semiconductor layer and applying a second electrode on the second semiconductor layer.
|
地址 |
Bejing CN |