发明名称 HIGH MODULUS AND IMPACT COMPOSITE FOR EMI SHIELDING
摘要 PURPOSE: A highly rigid electromagnetic interference shielding composite is provided to excellent dimensional stability by replacing an existing metal material. CONSTITUTION: A thermoplastic resins (40) of a highly rigid electromagnetic interference shielding composite forms a continuous phase. A semi-dispersed phase is formed by a first metal filler (10), a second metal filler (20) and a surface-treated carbon fiber (30). The first filler continuously or discontinuously surrounds the surface of the second metal filler. The surface-treated carbon fiber is treated by resin and metal and the treated resin consists of polyamide and epoxy resin. The melting point of the thermoplastic resin, the first metal filler and the second metal filler satisfies Tma-30°C> Tmb and Tma+500°C < Tmc, respectively.
申请公布号 KR101411021(B1) 申请公布日期 2014.06.24
申请号 KR20110146570 申请日期 2011.12.29
申请人 发明人
分类号 B32B27/12;H05K9/00 主分类号 B32B27/12
代理机构 代理人
主权项
地址