| 发明名称 |
Method for manufacturing a read head having conductive filler in insulated hole through substrate |
| 摘要 |
A method for manufacturing a read head includes the step of depositing a conductive filler into a plurality of holes that extend through a wafer. Each of the holes extends from a wafer top surface to a wafer bottom surface. Each of the holes includes an inner surface that includes an insulative layer. The method further includes the steps of fabricating a read transducer on the wafer top surface, and depositing a plurality of electrically conductive leading connection pads on the wafer bottom surface. The plurality of electrically conductive leading connection pads are in electrical contact with the conductive filler. |
| 申请公布号 |
US8756795(B1) |
申请公布日期 |
2014.06.24 |
| 申请号 |
US201213426438 |
申请日期 |
2012.03.21 |
| 申请人 |
Western Digital (Fremont), LLC |
发明人 |
Moravec Mark D.;I Gusti Made Subrata;Pumkrachang Santi |
| 分类号 |
G11B5/127;H04R31/00;G11B5/187;G11B5/265;G11B5/48;G11B7/00;G11B7/005;G11B7/22 |
主分类号 |
G11B5/127 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a read head, the method comprising:
depositing a conductive filler into a plurality of holes that extend through a wafer, each of the holes extending from a wafer top surface to a wafer bottom surface, each of the holes including an inner surface that includes an insulative layer; fabricating a read transducer on the wafer top surface; depositing a plurality of electrically conductive leading connection pads on the wafer bottom surface, the plurality of electrically conductive leading connection pads being in electrical contact with the conductive filler.
|
| 地址 |
Fremont CA US |
