发明名称 Thermal testing system and method
摘要 A thermal testing system for an electronic device includes at least one airflow sensor, at least one temperature sensor, a data collecting module, and a computer. The at least one airflow sensor is configured to sense an airflow speed in the electronic device. The at least one temperature sensor is configured to sense temperature information of the electronic device. The data collecting module is connected to the at least one airflow sensor and the at least one temperature sensor, and configured to receive analog signals sensed by the at least one airflow sensor and the at least one temperature sensor and convert the analog signals to digital signals. The computer is connected to the data collecting module, and configured to receive the digital signals from the data collecting module and display a test result.
申请公布号 US8762098(B2) 申请公布日期 2014.06.24
申请号 US201113077418 申请日期 2011.03.31
申请人 Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.;Hon Hai Precision Industry Co., Ltd. 发明人 Liu Fu-Ming
分类号 G01K13/00 主分类号 G01K13/00
代理机构 Novak Druce Connolly Bove + Quigg LLP 代理人 Novak Druce Connolly Bove + Quigg LLP
主权项 1. A thermal testing system for an electronic device comprising: at least one airflow sensor configured to sense an airflow speed in the electronic device; at least one temperature sensor configured to sense temperature information of the electronic device; a data collecting module, connected to the at least one airflow sensor and the at least one temperature sensor, configured to receive analog signals sensed by the at least one airflow sensor and the at least one temperature sensor and convert the analog signals to digital data; a computer, connected to the data collecting module, configured to receive the digital data from the data collecting module and display a test result; an environmental test chamber configured to accommodate the electronic device therein; and a power supply apparatus configured to supply power to the electronic device and the environmental test chamber; wherein the power supply apparatus comprises a power input port connected to an alternative current (AC) power source, a power converter configured to convert the AC power source to working voltages for the electronic device and the environmental test chamber, and a power output port configured to output the working voltages to the electronic device and the environmental test chamber, the power supply apparatus further comprises a single chip microcontroller configured to enable the power output port to output the working voltages when a predetermined environmental condition is satisfied.
地址 Shenzhen CN