Electroplating apparatus

摘要

A system for electroplating a rotogravure cylinder out of a plating solution having a concentration of copper ions wherein the cylinder is connectable to a current source is provided. The system includes a plating apparatus configured to copper plate the cylinder comprising a non-dissolvable anode, a plating tank configured to receive the cylinder, a controller configured to control operation of the apparatus, and a tube for delivering a mixture of a hardener and the plating solution to the plating tank.

主权项

1. A system for electroplating a rotogravure cylinder out of a plating solution having a concentration of copper ions wherein the cylinder is connectable to a current source, the system comprising:
a plating apparatus configured to copper plate the cylinder comprising a non-dissolvable anode; a plating tank configured to receive the cylinder; a controller configured to control operation of the apparatus; and a tube for delivering a mixture of a hardener and the plating solution to the plating tank, the tube having a first end and a second end, the first end coupled to a spray bar disposed in the plating tank and configured to provide the mixture on or near the cylinder; and an acidic rinse connection system configured to deoxidize the cylinder after plating and having a first end coupled to the second end of the tube, the acidic rinse connection system having a dosing pump configured to provide acid to the tube to create a mixture of the acid and the plating solution comprising between 0.5 and 5 percent by weight of sulfuric acid.