Process for making a heat radiating structure for high-power LED

摘要

A process of making a heat radiating structure for high-power LED comprises: (1) providing a PCB board, a heat conducting plate and a heat radiating plate; (2) providing a first locating hole and a first fixation hole penetrating the PCB board, and welding a copper plate to one side of the PCB board; while soldering an electrode welding leg to the other side of the PCB board; (3) providing a second locating hole and a second fixation hole penetrating the heat conducting plate; (4) using a fixation column to pierce through both of the fixation holes for connecting together the PCB board and the heat conducting plate; (5) using a heat conducting column to pierce through both of the locating holes; (6) placing the integral piece of the heat conducting plate and the PCB board on a pressing equipment to adjust the height of the heat conducting column.

主权项

1. A process of making a heat radiating structure for LED comprises:
(1) providing a PCB board (4), a heat conducting plate (6) and a heat radiating plate (9); (2) providing a first locating hole (41) and a first fixation hole (42) penetrating both sides of the PCB board (4), and welding a copper plate (5) to one side of the PCB board (4); while soldering an electrode welding leg (3) to the other side of the PCB board (4), then coating the surface of the copper plate (5) with a solder paste; (3) providing a second locating hole (61) and a second fixation hole (62) penetrating both sides of the heat conducting plate (6); (4) overlaying one side of the heat conducting plate (6) with one side of the PCB board (4) which side is provided with the copper plate (5), and the first locating hole (41) being arranged in correspondence with the position of the second locating hole (61), similarly, the first fixation hole (42) being arranged in correspondence with the position of the second fixation hole (62); using a fixation column (8) to pierce through both of the first fixation hole (42) and the second fixation hole (62) for connecting together the PCB board (4) and the heat conducting plate (6) to form an integral piece of them; (5) using a heat conducting column (7) to pierce through both of the first locating hole (41) and the second locating hole (61), and one end of the heat conducting column (7) being protruded outside one side of the PCB board (4), a length of the protruding end of the heat conducting column (7) being greater than a thickness of the electrode welding leg (3); (6) placing the integral piece of the heat conducting plate (6) and the PCB board (4) produced by the step (5) on a pressing equipment, and utilizing the pressing equipment to press an upper-end surface of the heat conducting column (7) so as to adjust the length of the protruding end of the heat conducting column (7), and to make the upper-end surface of the heat conducting column (7) and the upper surface of the electrode welding leg (3) be on a same plane; (7) pasting an inner side of the heat radiating plate (9) on other side of the heat conducting plate (6) fixedly.