| 摘要 |
The method involves holding a substrate (1a) e.g. glass sheet, by two support points (S1, S2), and positioning substrate and another substrate (1b) e.g. silicon tile, so that surfaces (2a, 2b) of the substrates are provided opposite to each other. The former substrate is deformed by applying a strain (F) between a pressure point (P1) and the two support points, where the strain is directed toward the other substrate. The deformed surface and latter surface are in contact with each other, and the strain is progressively released. |
