Electronic device and method of manufacturing the same

摘要

An electronic device comprises a functional stack (10) and a cover (50) coupled thereto by an insulating adhesive layer (30). The functional stack (10) comprises a first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer.;The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electrically interconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).

主权项

1. An electronic device, comprising a functional stack (10; 110; 210; 310; 410; 510; 610) and a cover (50; 150; 250; 350; 450; 550; 650) coupled thereto by an insulating adhesive layer (28; 128; 228; 328; 428; 528; 628), the functional stack comprising a first transparent and electrically conductive layer (22; 122; 222; 322; 422; 522; 622), a second electrically conductive layer (24; 124; 224; 324; 424; 524; 624) and a functional structure (26; 126; 226; 326; 426; 526; 626), comprising at least one optically functional layer, sandwiched between said first and second conductive layer,
the cover (50; 150; 250; 350; 450; 550; 650) including a substrate (52; 152; 252; 352; 452; 552; 652) provided with at least a first electrically conductive structure (66; 166; 266; 366a; 466a; 566; 666) arranged in a first plane between the adhesive layer (28; 128; 228; 328; 428; 528; 628) and the substrate (52; 152; 252; 352; 452; 552; 652), and wherein first transverse electrical conductors (32; 132; 232; 332; 432; 532; 632) transverse to the first plane (61; 161; 261; 361; 461; 561; 661) electrically interconnect one of the first and the second electrically conductive layer (22; 122; 222; 322; 422; 522; 622) with the first conductive structure (66; 166; 266; 366a; 466a; 566; 666, wherein the second electrically conductive layer (124) is provided with holes (137) having an inner portion (137a) and a ring-shaped outer-portion (137b) separate from the inner portion and wherein the first transverse conductors (138) extend through the inner portion (137a).