发明名称 |
STT-MRAM MTJ manufacturing method with in-situ annealing |
摘要 |
A spin transfer torque magnetic random access memory (STTMRAM) element and a method of manufacturing the same is disclosed having a free sub-layer structure with enhanced internal stiffness. A first free sub-layer is deposited, the first free sub-layer being made partially of boron (B), annealing is performed of the STTMRAM element at a first temperature after depositing the first free sub-layer to reduce the B content at an interface between the first free sub-layer and the barrier layer, the annealing causing a second free sub-layer to be formed on top of the first free sub-layer and being made partially of B, the amount of B of the second free sub-layer being greater than the amount of B in the first free sub-layer. Cooling down the STTMRAM element to a second temperature that is lower than the first temperature and depositing a third free sub-layer directly on top of the second free layer, with the third free sub-layer being made partially of boron (B), wherein the amount of B in the third sub-free layer is less than the amount of B in the second free sub-layer. |
申请公布号 |
US8758850(B2) |
申请公布日期 |
2014.06.24 |
申请号 |
US201113238972 |
申请日期 |
2011.09.21 |
申请人 |
Avalanche Technology, Inc. |
发明人 |
Zhou Yuchen;Huai Yiming |
分类号 |
G11C15/02 |
主分类号 |
G11C15/02 |
代理机构 |
|
代理人 |
Imam Maryam;Yen Bing K |
主权项 |
1. A method of manufacturing a spin transfer torque magnetic random access memory (STTMRAM) magnetic tunnel junction film stack comprising:
a) first depositing a magnetic interface layer on top of a barrier layer to form a magnetic tunnel junction (MTJ), the magnetic interface layer being made partially of boron (B) b) after the first depositing step, annealing the STTMRAM MTJ film stack at a first temperature after depositing the magnetic interface layer, the annealing being in-situ within a deposition system without breaking the vacuum thereby avoiding oxidization and contamination of the surface of the magnetic interface layer; c) after the annealing step, cooling down the STTMRAM MTJ film stack to a second temperature that is lower than the first temperature; and d) after the cooling down step, second depositing a top layer on top of the magnetic interface layer, wherein the top layer is made of a single layer or has a multi-layer structure necessary to make the MTJ stack function in the STTMRAM MTJ film stack, wherein the top layer comprises at least one magnetic sub-layer.
|
地址 |
Fremont CA US |