Electronic component and manufacturing method thereof

摘要

An electronic component that can be prevented from being mounted on a circuit board with inclination, and a manufacturing method thereof are provided. An electronic component is mountable on a circuit board including a first land and a second land. The electronic component includes outer electrodes on a lower surface of a stack to be arranged along a direction and are connectable to the first land and the second land, respectively. With the electronic component mounted to the circuit board, respective contact surfaces of the outer electrodes to the first land and the second land have a structure being symmetric about a line parallel to the direction, and each respective contact surface is divided into a plurality of portions.

主权项

1. An electronic component capable of being mounted on a circuit board including a first land and a second land, the component comprising:
a body; and a first outer electrode and a second outer electrode that are arranged in a predetermined direction on a mount surface of the body, and are connectable to the first land and the second land, respectively, wherein, with the first outer electrode and the second outer electrode connected to the first land and the second land, a first contact surface of the first outer electrode to the first land and a second contact surface of the second outer electrode to the second land have a structure being symmetric about a line parallel to the predetermined direction and each of the first contact surface and the second contact surface is divided into a plurality of portions.