发明名称 Light emitting element
摘要 A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
申请公布号 US8759869(B2) 申请公布日期 2014.06.24
申请号 US201213710812 申请日期 2012.12.11
申请人 Seoul Semiconductor Co., Ltd. 发明人 Seo Tae Won;Alexander Zhbanov;Kim Dae Won
分类号 H01L33/00 主分类号 H01L33/00
代理机构 H.C. Park & Associates, PLC 代理人 H.C. Park & Associates, PLC
主权项 1. A light emitting element, comprising: a lead, comprising: a plurality of leg sections;a connecting section connecting a first leg section and a second leg section of the plurality of leg sections; anda chip seating section disposed in the connecting section; a light emitting chip disposed on a first surface of the chip seating section; and a molding portion disposed on the connecting section, wherein the connecting section is completely encapsulated by the molding portion except a second surface of the chip seating section opposite to the first surface, and wherein the width of the entire connecting section is at least as wide as the chip seating section.
地址 Seoul KR