Method for cleaning photo masks and semiconductor wafers using a jetspray nozzle

摘要

A method of cleaning a photolithographic mask or semiconductor wafer involves mixing a gas and water in a jetspray nozzle and discharging the gas and water jetspray stream from a nozzle onto the photolithographic mask or wafer. The water jetspray stream is made up of a cluster of micro water droplets entrained in the gas having a predetermined size sufficient to dislodge contaminant particles adhered to the surface of the mask. The step of mixing the gas and water includes radially injecting the gas from a first plurality of circumferentially spaced apart gas nozzles into a stream of the water and radially injecting the gas from a second plurality of circumferentially spaced apart gas nozzles into the stream of the water, wherein the second plurality of gas nozzles are spaced above or below the first plurality of gas nozzles and radially offset from the first plurality of gas nozzles.

主权项

1. A method of cleaning a photolithographic mask or semiconductor wafer comprising:
providing a jetspray nozzle including a water inlet, a gas inlet, a plurality of gas injection nozzles, and a jetspray nozzle outlet; supplying water to the jetspray nozzle; supplying gas to the jetspray nozzle; mixing the gas and water in the jetspray nozzle; and discharging a gas and water jetspray stream from the nozzle onto the photolithographic mask or wafer, the water jetspray stream comprising a cluster of micro water droplets entrained in the gas having a predetermined size sufficient to dislodge contaminant particles adhered to the surface of the mask, wherein the step of mixing the gas and water includes radially injecting the gas from a first plurality of circumferentially spaced apart gas nozzles into a stream of the water, radially injecting the gas from a second plurality of circumferentially spaced apart gas nozzles into the stream of the water, the second plurality of gas nozzles being spaced above or below the first plurality of gas nozzles, wherein second plurality of gas nozzles are radially offset from the first plurality of gas nozzles.