SUBSTRATE EMBEDING ELECTRONIC ELEMENT AND MENUFACTURING OF SUBSTRATE EMBEDING ELECTRONIC ELEMENT

摘要

The present invention relates to a substrate embedding electronic element and a method of manufacturing a substrate embedding electronic element. The cross section of the first contact part of a first via which touches an external electrode is greater than that of the second contact part of a second via, thereby reducing the crack occurrence rate of the via and improving the throughput of a manufacturing process and the reliability in a use process.