| 摘要 |
A method for conducting inner and outer surfaces of wiring substrate of the present invention in electrically conducting a part of wiring pattern between inner and outer surfaces, in a wiring substrate which has conductor layers (3, 4) comprising a wiring pattern on the inner and outer surfaces of a synthetic film base (2), compressively presses a part (P) subject to be conductive from both sides of the wiring substrate with a pair of ultrasonic bonding units (5, 6), pushes the synthetic resin existing between the conductor layers of the corresponding part (P) subject to be conductive, makes the conductors of the inner and outer surfaces be in contact, and bonds the contacted conductors of the inner and outer surfaces by ultrasonic vibration from the ultrasonic bonding units. The ultrasonic vibration is sent to an ultrasonic carrier connected to the ultrasonic bonding units, and performs bonding by vibrating the ultrasonic bonding units connected to the ultrasonic carrier. According to the method, the inner and outer surfaces are sufficiently electrically conducted, and the conduction failure cannot occur although a thermal shock is applied to the part. |
