Film for use in manufacturing semiconductor device, method for producing semiconductor device and semiconductor device

摘要

A film for use in manufacturing a semiconductor device having at least one semiconductor element of the present invention is characterized by comprising: a base sheet having one surface; and a bonding layer provided on the one surface of the base sheet, the bonding layer being adapted to be bonded to the semiconductor element in the semiconductor device, the bonding layer being formed of a resin composition comprising a crosslinkable resin and a compound having flux activity. Further, it is preferred that in the film of the present invention, the semiconductor element is of a flip-chip type and has a functional surface, and the bonding layer is adapted to be bonded to the functional surface of the semiconductor element.

主权项

1. A film for use in manufacturing a semiconductor device having a substrate and at least one semiconductor element with an observable surface, the film comprising:
a base sheet having one surface; and a bonding layer provided on the one surface of the base sheet, the bonding layer being adapted to be bonded to the semiconductor element in the semiconductor device, the bonding layer being formed of a resin composition comprising a crosslinkable resin and a compound having flux activity, wherein the bonding layer has such transparency as to allow a pattern provided on the observable surface of the semiconductor element to be observed through the bonding layer when the bonding layer is bonded to the observable surface to thereby allow performing alignment between the semiconductor element and the substrate.