| 发明名称 | Light emitting device including support member and bonding member | ||
| 摘要 | A light emitting device includes a support member having a mounting surface. The support member includes an insulating member having top surface and a plurality of side surfaces, a first metal pattern disposed on the top surface of the insulating member, and a second metal pattern disposed on the side surface of the insulating member such that a side surface of the second metal pattern is continuous with a top surface of the first metal pattern. The light emitting device further includes a light emitting element mounted on the mounting surface at a location of the first metal pattern, and a bonding member that bonds the light emitting element to the mounting surface. The bonding member covers at least a portion of the first metal pattern and at least a portion of the second metal pattern. | ||
| 申请公布号 | US8759855(B2) | 申请公布日期 | 2014.06.24 |
| 申请号 | US201113229524 | 申请日期 | 2011.09.09 |
| 申请人 | Nichia Corporation | 发明人 | Kamada Kazuhiro |
| 分类号 | H01L33/00 | 主分类号 | H01L33/00 |
| 代理机构 | Foley & Lardner LLP | 代理人 | Foley & Lardner LLP |
| 主权项 | 1. A light emitting device comprising: a support member having a mounting surface, the support member comprising: an insulating member having a top surface and a plurality of side surfaces;a first metal pattern disposed on the top surface of the insulating member; anda second metal pattern disposed on at least one of the side surfaces of the insulating member such that a side surface of the second metal pattern is continuous with a top surface of the first metal pattern; a light emitting element mounted on the mounting surface at a location of the first metal pattern; and a bonding member that bonds the light emitting element to the mounting surface, wherein the bonding member covers at least a portion of the first metal pattern and at least a portion of the second metal pattern. | ||
| 地址 | Anan-shi JP | ||