发明名称 Wire to conductive metal plate laser welding structure
摘要 A laser welding structure that is formed by joining a stranded wire (wire) of a signal line and a welding portion (conductive metal plate) by locally applying a laser beam and thereby melting and solidifying the stranded wire of the signal line and the welding portion has the following features. That is, the melting point of the stranded wire of the signal line and the melting point of the welding portion are different. The laser welding structure is obtained by applying a laser beam to one of the stranded wire of the signal line and the welding portion that has a higher melting point, i.e., to the welding portion having a higher melting point.
申请公布号 US8759679(B2) 申请公布日期 2014.06.24
申请号 US201113238634 申请日期 2011.09.21
申请人 Japan Aviation Electronics Industry, Ltd. 发明人 Yoshida Takushi;Inudo Tomoki;Akimoto Hiroshi
分类号 B23K11/00;B23K26/00 主分类号 B23K11/00
代理机构 Maier & Maier, PLLC 代理人 Maier & Maier, PLLC
主权项 1. A laser welding structure formed by joining a wire and a conductive metal plate by locally applying a laser beam and thereby melting and solidifying both the wire and the conductive metal plate, wherein a melting point of the wire and a melting point of the conductive metal plate are different from each other, the laser beam is applied to one of the wire and the conductive metal plate that has a higher melting point, the melting point of the conductive metal plate is higher than the melting point of the wire, before the melting, the conductive metal plate has a wide shape so that the wire is concealed behind the conductive metal plate as viewed in an irradiation direction of the laser beam, and the conductive metal plate has a first surface facing to the wire and a second surface which is a surface opposite to the first surface, and the laser beam is applied to the second surface.
地址 Tokyo JP