主权项 |
1. A method of making light emitting diodes comprising:
providing a substrate having a first side and a second side opposite to the first side; forming a buffer layer on the first side of the substrate; forming a first-type semiconductor layer on the buffer layer; forming an active layer on the first-type semiconductor layer; forming a second-type semiconductor layer on the active layer; forming a first contact structure on a surface of the second-type semiconductor layer; forming a second contact structure on the first-type semiconductor layer facing the same direction of the first contact structure; and reducing a thickness of the substrate to be less than 350 μm, wherein the first contact structure comprises a structure that includes metallic elements that order proceeds from the surface of the second-type semiconductor layer, the structure is selected from:
a first structure that is arranged in the order of ITO, Au, Ni, and Au;a second structure that is arranged in the order of ITO, Au, Pd, and Au;a third structure that is arranged in the order of ITO, Ni, Pd, and Au; anda fourth structure that is arranged in the order of ITO, Pt, and Au.
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