| 发明名称 | Method of manufacturing LED lamp | ||
| 摘要 | A method of manufacturing a LED lamp that is formed by sealing a LED element mounted on a substrate with glass, includes a mounting process for mounting the LED element on the substrate, a sealing member preparation process for preparing a glass sealing member that includes a concave portion being capable of housing the LED element, and a sealing process wherein the sealing member is arranged so that a forming surface of the concave portion faces the LED element, the sealing member is bonded to the substrate by thermal compression bonding, and the forming surface of the concave portion is made along the LED element. | ||
| 申请公布号 | US8759123(B2) | 申请公布日期 | 2014.06.24 |
| 申请号 | US201012659954 | 申请日期 | 2010.03.25 |
| 申请人 | Toyoda Gosei Co., Ltd. | 发明人 | Wada Satoshi;Moriyama Miki |
| 分类号 | H01L21/00 | 主分类号 | H01L21/00 |
| 代理机构 | McGinn IP Law Group, PLLC | 代理人 | McGinn IP Law Group, PLLC |
| 主权项 | 1. A method of manufacturing an LED lamp, the method comprising: mounting an LED element on a substrate; preparing a glass sealing member that includes a concave portion to house the LED element; and sealing the LED element by the glass sealing member, wherein, in the sealing, the glass sealing member is arranged so that a forming surface of the concave portion faces the LED element, and the glass sealing member is bonded to the substrate by a thermal compression bonding such that the forming surface of the concave portion is made along the LED element so as to eliminate substantially a gap between the glass sealing member and the LED element, and wherein, in the sealing the glass sealing member, the thermal compression bonding is conducted at a temperature T (° C.) to meet an expression (1) below: Tg<T≦Ap+30° C. (1) where Tg (° C.) is a glass-transition temperature of the sealing member and Ap (° C.) is a yielding point temperature of the sealing member. | ||
| 地址 | Kiyosu-Shi, Aichi-Ken JP | ||