发明名称 HIGH MODULUS AND IMPACT COMPOSITE FOR EMI SHIELDING
摘要 PURPOSE: A high impact and high stiffness electromagnetic shielding composite is provided to improve conductivity by increasing mechanical strength. CONSTITUTION: A thermoplastic resin is formed of crystalline thermoplastic resin. Second metal filler (20) is equipped with a sphere or flake shape. The weight ratio of first metal filler (10) is formed with 1:1. The weight ratio of the second metal filler is formed with 3:1. The diameter of a carbon fiber (30) is 3-10μm.
申请公布号 KR101411017(B1) 申请公布日期 2014.06.23
申请号 KR20110143776 申请日期 2011.12.27
申请人 发明人
分类号 B32B27/02;H05K9/00 主分类号 B32B27/02
代理机构 代理人
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