ADHESIVE COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM COMPRISING THE SAME

摘要

The present invention relates to an adhesive composition for a semiconductor and an adhesive film including the same, and more specifically, to an adhesive composition for a semiconductor with viscosity of 7000 Pa·s or less at 80 deg. C and 5000 Pa·s or less at 100 deg. C. According to one embodiment of the present invention, the adhesive composition for a semiconductor with a 0-10% of void area is obtained by bonding the film at 100-130 deg. C for 1-60 seconds and hardening the film at 125-150 deg. C for 10-60 minutes.