| 摘要 |
The present invention relates to an optical proximity sensor which is able to improve the light efficiency of a light source, improves an EMI shielding feature, and reduce manufacturing costs. The sensor of the present invention comprises: a reflector integrated type housing board which forms an inverse cone-shaped hole composing the lateral wall of a first cavity for mounting an IR LED chip, having a diameter of an end of playing an opening part which is larger than the diameter of a lower part, and having a cut big tip and a cone-shaped hole composing the lateral wall of a second cavity for mounting an optical sensor integrated type ASIC chip, having the diameter of an end of playing the role of an opening part which is larger than the diameter of the lower part, and having a smaller cut tip, forms a mirror surface having the illumination intensity of a surface so that the lateral wall of each hole has a good reflection, has a metal coated on the whole or a part, and also serves as a housing for protecting an accommodated element; a PCB substrate which forms the first cavity and the second cavity by adhering to the housing plate and forms a circuit pattern in order to mount each of the bottom surface of the first cavity and the elements accommodated on the bottom surface of the second cavity and wire for an electric connection; an IR LED chip which is mounted on the PCB substrate of the bottom of the first cavity formed by the housing plate and the PCB substrate and emits infrared light if power is supplied; and an optical sensor integrated type ASIC chip which senses proximity and the intensity of illumination by receiving infrared light which is reflected from an object while driving the IR LED chip if power is supplied by being mounted on the PCB substrate of the bottom surface of the second cavity which is formed by the housing plate and the PCB substrate. |
