发明名称 ATOMIC LAYER DEPOSITION APPARATUS
摘要 An atomic layer deposition apparatus according to the present invention comprises a gas intake and exhaust unit including a gas supply pipe having a gas supply channel formed therein, a gas exhaust pipe having a pressure relieving part formed therein and communicated with the gas supply channel, and a gas intake pipe surrounding at least a part of the outer circumferential surface of the gas exhaust pipe to form a gas intake channel therein; and a gas injection pressure controlling unit connected to the gas supply channel or the pressure relieving part and supplying gas so that the pressure of exhaust gas from the gas exhaust pipe is uniform over the entire length of the gas exhaust pipe, thereby controlling gas to be injected at uniform pressure or in a uniform amount.
申请公布号 KR20140076794(A) 申请公布日期 2014.06.23
申请号 KR20120145238 申请日期 2012.12.13
申请人 LIGADP CO., LTD. 发明人 JEON, HYEONG TAG;CHOI, HAG YOUNG
分类号 C23C16/448;C23C16/455;H01L21/205 主分类号 C23C16/448
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