| 摘要 |
The present invention provides a rotational molding device, as well as a rotational molding process which is characterized in that it has a lower power consumption compared to gas, since the heat is applied to the resin in a more direct manner, the resin melting at 120°C unlike conventional furnaces that increase their temperature up to 250°C or more, and where up to 98% of the heat is absorbed by the structure, mold and air; and where only 2% of the heat is used for melting the polymer. |
