| 摘要 |
The present invention provides a thermosetting resin composition having excellent chemical resistance after a calcining process, excellent surface smoothness, excellent heat resistance, excellent adhesion on a background substrate such as glass, and excellent transparency. The present invention provides a resin composition comprising: polyesteramide acid obtained by the reaction of a compound including tetracarboxylic acid dianhydride, diamine, and multi-valent hydroxyl compounds; an epoxy resin including 3-20 epoxy groups in one molecule and having a weight average molecular weight of 5,000 or smaller; and a polymer (A) obtained by radical-copolymerizing a radical-polymerizable compound (a1) represented by Formula (3), a radical-polymerizable compound (a2) having alkoxysilyl; and a radical-polymerizable compound (a3) having at least one from among epoxy, carboxyl, and hydroxyl phenyl. (R1 is hydrogen or methyl; R2 to R5 are C1-5 alkyl; R6 is C1-10 alkyl; m is an integer of 1-10; and n is an integer of 1-150.). |
