发明名称 DIELECTRIC ADDITIVES FOR MLCC AND METHOD FOR DISPERSION THEREOF
摘要 The present invention relates to dispersed dielectric additives for MLCC and a dispersion method thereof, wherein the additives have average particle diameter of 0.010-0.030 micrometers and Dmax of 0.130 micrometers or less. According to the present invention, when an individual nano-sized additive is separately dispersed, classified, mixed, and re-dispersed, a thin film with increased dispersibility, smoothness, and uniformity compared to an existing method can be produced. Therefore, when technology for manufacturing a thin film using dielectric additives according to the present invention is applied to a chip like MLCC, electric characteristics and chip reliability are improved.
申请公布号 KR20140076911(A) 申请公布日期 2014.06.23
申请号 KR20120145463 申请日期 2012.12.13
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LIM, CHUL TACK;LEE, YONG HWA
分类号 H01B3/10;B01F3/00;H01G4/12 主分类号 H01B3/10
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