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发明名称
利用掺杂或化合之金属氧化物半导体产生薄膜电晶体阵列的整合制程系统与制程顺序
摘要
申请公布号
TWI442574
申请公布日期
2014.06.21
申请号
TW098109408
申请日期
2009.03.23
申请人
应用材料股份有限公司 美国
发明人
叶雁
分类号
H01L29/786;H01L21/336
主分类号
H01L29/786
代理机构
代理人
蔡坤财 台北市中山区松江路148号11楼;李世章 台北市中山区松江路148号11楼
主权项
地址
美国
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