于积体电路封装之外部接头上之信号削弱补偿,申请号TW097135207-传众专利搜索

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发明名称	于积体电路封装之外部接头上之信号削弱补偿
摘要
申请公布号	TWI442487	申请公布日期	2014.06.21
申请号	TW097135207	申请日期	2008.09.12
申请人	德州仪器公司美国	发明人	雷维德拉　卡纳德;凡卡塔拉曼　斯维瓦山
分类号	H01L21/60;H01L21/77;H01L21/56;H01L21/70	主分类号	H01L21/60
代理机构		代理人	蔡瑞森台北市松山区敦化北路201号7楼
主权项
地址	美国

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